1. Our proprietary setup procedures enable us to plate in deep cavities, while maintaining electroform thickness with zero porosity.
我们拥有专利权的设置程序可以进行深腔镀膜，同时在无孔隙的情况下保持电镀厚度。
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2. No back plate growing method is to electroform metal microstructure on the metal substrate directly by low-cost UV-LIGA technology based on SU-8 photoresist.
3. No back plate growing method is to electroform metal microstructure on the metal substrate directly by low-cost UV-LIGA technology based on SU-8 photoresist.
The electroforming of Ni-Mn alloy for the thin-wall revolving part was carried out with a device that could be used to electroform a revolving part. 摘要利用可以电铸回转体零件的装置，开展了薄壁回转体零件的镍锰合金电铸试验。
Finally, the performance of the electroforming nickel layer accords with our use requirements using the optimum process parameters to electroform nickel in a model ship. 最后，采用本文研究得出的最佳工艺参数在一模型船上电铸镍，得到镍铸层的性能符合使用要求。
